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TPD4124AK
TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC
TPD4124AK
The TPD4124AK is a DC brush less motor driver using high voltage PWM control. It is fabricated by high voltage SOI process. It is three-shunt resistor circuit for current sensing. It contains level shift high-side driver, low-side driver, IGBT outputs, FRDs and protective functions for under voltage protection circuits and thermal shutdown circuit. It is easy to control a DC brush less motor by just putting logic inputs from a MPU or motor controller to the TPD4124AK.
HDIP26-P-1332-2.00
Weight: 3.8 g (typ.)
Features
* * * * * * * * * * High voltage power side and low voltage signal side terminal are separated. It is the best for current sensing in three shunt resistance. Bootstrap circuit gives simple high-side supply. Bootstrap diodes are built in. A dead time can be set as a minimum of 1.4 s, and it is suitable for a Sine-wave from drive. 3-phase bridge output using IGBTs. FRDs are built in. Included under voltage protection and thermal shutdown. The regulator of 7 V (typ.) is built in. Package: 26-pin DIP.
This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge.
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Marking
GND 1 NC 2 NC 3 HU 4 HV 5 HW 6 LU 7 LV 8 LW 9 SD 10 DIAG 11 NC 12 VREG 13 NC 14 VCC 15 GND 16
19 IS1 25 W 24 BSW 26 IS3 23 VBB
Pin Assignment
Part No. (or abbreviation code)
TPD4124AK TPD4125K
2
Lot Code (Weekly code)
22 V 21 BSV
20 IS2
18 BSU 17 U
TPD4124AK
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Block Diagram
VCC 15
18 BSU 21 BSV 24 BSW 7V Regulator 23 VBB UnderUnderUndervoltage voltage voltage Protection Protection Protection Undervoltage Protection High-side Level Shift Driver
VREG 13
HU HV HW LU LV LW
4 5 6 7 8 9 Low-side Driver Input Control Thermal Shutdown 17 U 22 V 25 W
SD 10 DIAG 11
26 IS3 20 IS2 19 IS1 1/16 GND
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Pin Description
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Symbol GND NC NC HU HV HW LU LV LW SD DIAG NC VREG NC VCC GND U BSU IS1 IS2 BSV V VBB BSW W IS3 Ground pin. Unused pin, which is not connected to the chip internally. Unused pin, which is not connected to the chip internally. The control terminal of IGBT by the high side of U. It turns off less than 1.5 V. It turns on more than 2.5 V. The control terminal of IGBT by the high side of V. It turns off less than 1.5 V. It turns on more than 2.5 V. The control terminal of IGBT by the high side of W. It turns off less than 1.5 V. It turns on more than 2.5 V. The control terminal of IGBT by the low side of U. It turns off less than 1.5 V. It turns on more than 2.5 V. The control terminal of IGBT by the low side of V. It turns off less than 1.5 V. It turns on more than 2.5 V. The control terminal of IGBT by the low side of W. It turns off less than 1.5 V. It turns on more than 2.5 V. Input pin of external protection. ("L" active, It doesn't have hysteresis) With the diagnostic output terminal of open drain, a pull-up is carried out by resistance. It turns on at the time of unusual. Unused pin, which is not connected to the chip internally. 7 V regulator output pin. Unused pin, which is not connected to the chip internally. Control power supply pin. (15 V typ.) Ground pin. U-phase output pin. U-phase bootstrap capacitor connecting pin. U-phase IGBT emitter and FRD anode pin. V-phase IGBT emitter and FRD anode pin. V-phase bootstrap capacitor connecting pin. V-phase output pin. High-voltage power supply input pin. W-phase bootstrap capacitor connecting pin. W-phase output pin. W-phase IGBT emitter and FRD anode pin. Pin Description
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Equivalent Circuit of Input Pins
Internal circuit diagram of HU, HV, HW, LU, LV, LW input pins
200 k
HU/HV/HW LU/LV/LW
2 k
2 k 6.5 V 6.5 V
2 k 6.5 V 6.5 V
Internal circuit diagram of SD pin
VREG 200 k
SD
2 k
2 k
2 k 6.5 V 6.5 V
To internal circuit
6.5 V 6.5 V
Internal circuit diagram of DIAG pin
DIAG
To internal circuit 26 V 250 k
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TPD4124AK
Timing Chart
HU
HV
HW
Input Voltage
LU
LV
LW
VU
Output voltage VV
VW
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Truth Table
Input Mode Normal HU H H L L L L Thermal shutdown H H L L L L HV L L H H L L L L H H L L L L H H L L L L H H L L * HW L L L L H H L L L L H H L L L L H H L L L L H H * LU L L L H H L L L L H H L L L L H H L L L L H H L * LV H L L L L H H L L L L H H L L L L H H L L L L H * LW L H H L L L L H H L L L L H H L L L L H H L L L * SD H H H H H H H H H H H H H H H H H H H H H H H H L ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF High side OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF Low side ON OFF OFF OFF OFF ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON OFF OFF OFF OFF ON OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF U phase V phase W phase U phase V phase W phase DIAG OFF OFF OFF OFF OFF OFF ON ON ON ON ON ON ON ON ON ON ON ON OFF OFF OFF OFF OFF OFF ON
VCC Under-voltage
H H L L L L
VBS Under-voltage
H H L L L L
SD
*
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Absolute Maximum Ratings (Ta = 25C)
Characteristics Power supply voltage Output current (DC) Output current (pulse) Input voltage VREG current Power dissipation (IGBT1 phase (Tc = 25C) ) Power dissipation (FRD1 phase (Tc = 25C) ) Operating temperature Junction temperature Storage temperature Symbol VBB VCC IOUT IOUTp VIN IREG PC(IGBT Rating 500 18 2 3 -0.5 to 7 50 36 Unit V V A A V mA W
PC(FRD) Tjopr Tj Tstg
22 -40 to 135 150 -55 to 150
W C C C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
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Electrical Characteristics (Ta = 25C)
Characteristics Operating power supply voltage Symbol VBB VCC IBB Current dissipation ICC IBS (ON) IBS (OFF) Input voltage SD input voltage Input current VIH VIL VSD IIH IIL ISDH ISDL VCEsatH VCEsatL VFH VFL VF (BSD) VREG TSD TSD VCCUVD VCCUVR VBSUVD VBSUVR VDIAGsat ton toff tdead trr IDIAG = 5 mA VBB = 280 V, VCC = 15 V, IC = 1 A VBB = 280 V, VCC = 15 V, IC = 1 A VBB = 280 V, VCC = 15 V, IC = 1 A VBB = 280 V, VCC = 15 V, IC = 1 A VBB = 450 V VCC = 15 V VBS = 15 V, high side ON VBS = 15 V, high side OFF VIN = "H", VCC = 15 V VIN = "L" , VCC = 15 V VCC = 15 V VIN = 5 V VIN = 0 V VIN = 5 V VIN = 0 V VCC = 15 V, IC = 1 A, high side VCC = 15 V, IC = 1 A, low side IF = 1 A, high side IF = 1 A, low side IF = 500 A VCC = 15 V, IO = 30 mA VCC = 15 V VCC = 15 V Test Condition Min 50 13.5 2.5 6.5 135 10 10.5 8 8.5 1.4 Typ. 280 15 0.9 230 200 2.5 2.4 2.4 1.5 1.5 0.9 7 50 11 11.5 9 9.5 1.4 1.0 200 Max 450 16.5 0.5 5 410 370 1.5 150 100 100 150 3 3 2.0 2.0 1.2 7.5 185 12 12.5 9.5 10.5 0.5 3 3 Unit V
mA
A
V V A
SD Input current
A
Output saturation voltage
V
FRD forward voltage BSD forward voltage Regulator voltage Thermal shutdown temperature Thermal shutdown hysteresis VCC under voltage protection VCC under voltage protection recovery VBS under voltage protection VBS under voltage protection recovery DIAG saturation voltage Output on delay time Output off delay time Dead time FRD reverse recovery time
V V V C C V V V V V s s s ns
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Application Circuit Example
15V VCC 15 C4 + C5 18 21 24 13 7V Regulator UnderUnderUndervoltage voltage voltage Protection Protection Protection High-side Level Shift Driver Thermal Shutdown Low-side Driver 26 IS3 20 IS2 19 IS1 R R R 17 22 25 U V W 23
BSU BSV BSW VBB
+ C6
C7
VREG
Undervoltage Protection HU Control IC or Microcomputer HV HW LU LV LW R1 R2 4 5 6 7 8 9 Input Control
C1 C2 C3 C
M
DIAG 11 10 SD
1/16 GND
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External Parts
Typical external parts are shown in the following table.
Part C1, C2, C3 C4 C5 C6 C7 R1 R2 Typical 25 V/2.2 F 25 V/10 F 25 V/0.1 F 25 V/1 F 25 V/1000 pF 5.1 k 10 k Purpose Bootstrap capacitor VCC power supply stability VCC for surge absorber VREG power supply stability VREG for surge absorber DIAG pin pull-up resistor SD pin pull-up resistor Remarks (Note 1) (Note 2) (Note 2) (Note 2) (Note 2) (Note 3)
Note 1: The required bootstrap capacitance value varies according to the motor drive conditions. The capacitor is biased by VCC and must be sufficiently derated for it. Note 2: When using this product, adjustment is required in accordance with the use environment. When mounting, place as close to the base of this product leads as possible to improve the ripple and noise elimination. Note 3: The DIAG pin is open drain. If not using the DIAG pin, connect to the GND.
Handling precautions
(1) Please control the input signal in the state to which the VCC voltage is steady. Both of the order of the VBB power supply and the VCC power supply are not cared about either. Note that if the power supply is switched off as described above, this product may be destroyed if the current regeneration route to the VBB power supply is blocked when the VBB line is disconnected by a relay or similar while the motor is still running. (2) The excess voltage such as the voltage surge which exceed the maximum rating is added, for example, may destroy the circuit. Accordingly, be careful of handling this product or of surge voltage in its application environment.
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Description of Protection Function
(1) Under voltage protection This product incorporates under voltage protection circuits to prevent the IGBT from operating in unsaturated mode when the VCC voltage or the VBS voltage drops. When the VCC power supply falls to this product internal setting VCCUVD (=11 V typ.), all IGBT outputs shut down regardless of the input. This protection function has hysteresis. When the VCC power supply reaches 0.5 V higher than the shutdown voltage (VCCUVR (=11.5 V typ.)), this product is automatically restored and the IGBT is turned on again by the input. DIAG output is reversed at the time of VCC under-voltage protection. When the VCC power supply is less than 7 V, DIAG output isn't sometimes reversed. When the VBS supply voltage drops VBSUVD (=9 V typ.), the high-side IGBT output shuts down. When the VBS supply voltage reaches 0.5 V higher than the shutdown voltage (VBSUVR (=9.5 V typ.)), the IGBT is turned on again by the input signal. (2) Thermal shutdown This product incorporates a thermal shutdown circuit to protect itself against the abnormal state when its temperature rises excessively. When the temperature of this chip rises to the internal setting TSD due to external causes or internal heat generation, all IGBT outputs shut down regardless of the input. This protection function has hysteresis TSD (=50C typ.). When the chip temperature falls to TSD - TSD, the chip is automatically restored and the IGBT is turned on again by the input. Because the chip contains just one temperature detection location, when the chip heats up due to the IGBT, for example, the differences in distance from the detection location in the IGBT (the source of the heat) cause differences in the time taken for shutdown to occur. Therefore, the temperature of the chip may rise higher than the thermal shutdown temperature when the circuit started to operate. (3) SD pin SD pin is the input signal pin to shut down the internal output IGBT. Output of all IGBT is shut down after delay times (2 s typ.) when "L" signal is input to the SD pin from external circuit (MCU etc.). It is possible to shut down IC when overcurrent and others is detected by external circuit. Shut down state is released by all of IC input signal "L". At open state of SD pin, shut down function can not operate.
Timing Chart of Under voltage protection and SD Function
SD LIN HIN VBS VCC LO HO DIAG Note: The above timing chart is considering the delay time ton
toff ton toff
Safe Operating Area
Peak winding current (A) 2 1.9
0
400 450 0 Power supply voltage VBB (V) Figure 1 SOA at Tj = 135 C
Note 1: The above safe operating areas are Tj = 135 C (Figure 1).
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VCEsatH - Tj (V)
VCC = 15 V 3.0 IC = 1.6 A
VCEsatL - Tj VCEsatL (V)
3.4 VCC = 15 V 3.0 IC = 1.6 A
3.4
VCEsatH
IGBT saturation voltage
2.2 IC = 0.8 A 1.8 IC = 0.4 A
IGBT saturation voltage
2.6
IC = 1.2 A
2.6
IC = 1.2 A
2.2 IC = 0.8 A 1.8
IC = 0.4 A
1.4 -50
0
50
100
150
1.4 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
VFH - Tj (V) VFL (V)
2.4 2.4
VFL - Tj
VFH
2.0
IF = 1.6 A
2.0
IF = 1.6 A
FRD forward voltage
FRD forward voltage
IF = 1.2 A 1.6 IF = 0.8 A 1.2 IF = 0.4 A
IF = 1.2 A 1.6 IF = 0.8 A 1.2 IF = 0.4 A
0.8 -50
0
50
100
150
0.8 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
ICC - VCC
2.0 Tj =-40C 8.0 Tj =25C Tj =135C 1.5
VREG - VCC
Tj =-40C Tj =25C Tj =135C 7.5 IREG = 30 mA
(mA)
Current dissipation
1.0
Regulator voltage
VREG
14 16 18
ICC
(V)
7.0
0.5
6.5
0 12
6.0 12
14
16
18
Control power supply voltage
VCC
(V)
Control power supply voltage
VCC
(V)
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ton - Tj
3.0
toff - Tj
3.0
(s)
ton
2.0
toff
High-side Low-side
(s)
VBB = 280 V VCC = 15 V IC = 1 A
VBB = 280 V VCC = 15 V IC = 1 A High-side Low-side
2.0
Output-on delay time
Output-off delay time
1.0
1.0
0 -50
0
50
100
150
0 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
VCCUV - Tj
12.5 10.5 VCCUVD VCCUVR 12.0
VBSUV - Tj Under-voltage protection operating voltage VBSUV (V)
VBSUVD VBSUVR 10.0
Under-voltage protection operating voltage VCCUV (V)
11.5
9.5
11.0
9.0
10.5
8.5
10.0 -50
0
50
100
150
8.0 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
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IBS (ON) - VBS
500 500 Tj =25C Tj =135C 400
IBS (OFF) - VBS (A)
Tj =-40C Tj =25C 400 Tj =135C
(A)
Tj =-40C
Current dissipation
200
Current dissipation
300
IBS (OFF)
IBS (ON)
300
200
100 12
14
16
18
100 12
14
16
18
Control power supply voltage
VBS
(V)
Control power supply voltage
VBS
(V)
Wton - Tj
500 100
Wtoff - Tj
(J)
400 IC = 1.6 A 300 IC = 1.2 A
(J)
80
IC = 1.6 A IC = 1.2 A
Wton
Wtoff
60
Turn-on loss
Turn-off loss
200
40
IC = 0.8 A
IC = 0.8 A 100 IC = 0.4 A
20
IC = 0.4 A
0 -50
0
50
100
150
0 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
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Test Circuits
1 GND 26 IS3 26 IS3 2 NC 3 NC 25 W 24 BSW 4 HU 5 HV 6 HW 23 VBB 7 LU 8 LV 9 LW 10 SD 11 DIAG 20 IS2 19 IS1 12 NC 13 VREG 14 NC 15 VCC 16 GND 18 BSU 17 U 20 IS2 19 IS1 21 BSV 1 GND
2 NC 25 W 24 BSW
3 NC
4 HU
5 HV
6 HW 23 VBB
7 LU
FRD Forward Voltage (U-phase low side)
8 LV 22 V 21 BSV
22 V
IGBT Saturation Voltage (U-phase low side)
9 LW
10 SD
16
VM
18 BSU 17 U
11 DIAG
12 NC
13 VREG
14 NC
VM
15 VCC
16 GND
1.0A HU = 0V HV = 0V HW = 0V LU = 5V LV = 0V LW = 0V VCC = 15V
1.0A
TPD4124AK
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1 GND 26 IS3 2 NC 3 NC 25 W 24 BSW 4 HU 5 HV 23 VBB 7 LU 8 LV 9 LW 21 BSV 10 SD 11 DIAG 20 IS2 19 IS1 12 NC 13 VREG 14 NC 18 BSU 17 U 15 VCC 18 BSU 20 IS2 19 IS1 21 BSV 6 HW 23 VBB 26 IS3
1 GND
Regulator Voltage
2 NC 25 W 24 BSW
3 NC
VCC Current Dissipation
4 HU
5 HV
6 HW
7 LU
8 LV 22 V
22 V
9 LW
10 SD
17
IM
11 DIAG
VM
12 NC
13 VREG
30mA VCC = 15V
14 NC
15 VCC
16 GND
16 GND
17 U
VCC = 15V
TPD4124AK
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Output ON/OFF Delay Time (U-phase low side)
IM
U = 280V
2.2F
280
24 BSW
11 DIAG
13 VREG
1 GND
18 BSU
21 BSV
23 VBB
26 IS3
20 IS2
19 IS1
25 W
16 GND
15 VCC
6 HW
2 NC
3 NC
4 HU
12 NC
14 NC
9 LW
10 SD
5 HV
7 LU
8 LV
17 U
22 V
HU = 0V HV = 0V HW = 0V LU = PG LV = 0V LW = 0V VCC = 15V
90% LU = PG 10%
90%
IM
10%
ton
toff
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VCC Under-voltage Protection Operating/Recovery Voltage (U-phase low side)
U = 18V 2k
24 BSW
11 DIAG
13 VREG
1 GND
18 BSU
21 BSV
23 VBB
26 IS3
20 IS2
19 IS1
25 W
16 GND
15 VCC
6 HW
2 NC
3 NC
4 HU
12 NC
14 NC
9 LW
10 SD
5 HV
7 LU
8 LV
17 U
22 V
VM
HU = 0V HV = 0V HW = 0V LU = 5V LV = 0V LW = 0V VCC = 15V 6V 6V 15V
*Note: Sweeps the VCC pin voltage from 15 V and monitors the U pin voltage. The VCC pin voltage when output is off defines the under-voltage protection operating voltage. Also sweeps from 6 V to increase. The VCC pin voltage when output is on defines the under voltage protection recovery voltage.
VBS Under-voltage Protection Operating/Recovery Voltage (U-phase high side)
VBB = 18V 2k
VM
BSU = 15V 6V 6V 15V
24 BSW
11 DIAG
13 VREG
1 GND
18 BSU
21 BSV
23 VBB
26 IS3
20 IS2
19 IS1
25 W
16 GND
15 VCC
6 HW
2 NC
3 NC
4 HU
12 NC
14 NC
9 LW
10 SD
5 HV
7 LU
8 LV
17 U
22 V
HU = 5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V *Note: Sweeps the BSU pin voltage from 15 V to decrease and monitors the VBB pin voltage. The BSU pin voltage when output is off defines the under voltage protection operating voltage. Also sweeps the BSU pin voltage from 6V to increase and change the HU pin voltage at 5 V0 V5 V each time. It repeats similarly output is on. When the BSU pin voltage when output is on defines the under voltage protection recovery voltage.
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1 GND 26 IS3 2 NC 3 NC 25 W 24 BSW 4 HU 5 HV 6 HW 7 LU 8 LV 9 LW 10 SD 11 DIAG 12 NC 13 VREG 14 NC 15 VCC 16 GND 18 BSU 17 U 20 IS2 19 IS1 21 BSV 23 VBB
VBS Current Dissipation (U-phase high side)
22 V
20
HU = 0V/5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V
IM
BSU = 15V
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Turn-On/Off Loss (low side IGBT + high side FRD)
5mH L 2.2F
IM VM
VBB/U = 280V
24 BSW
11 DIAG
13 VREG
1 GND
18 BSU
21 BSV
23 VBB
26 IS3
20 IS2
19 IS1
25 W
16 GND
15 VCC
6 HW
2 NC
3 NC
4 HU
12 NC
14 NC
9 LW
10 SD
5 HV
7 LU
8 LV
17 U
22 V
HU = 0V HV = 0V HW = 0V LU = PG LV = 0V LW = 0V VCC = 15V
Input (LU = PG)
IGBT (C-E Voltage) (U-GND)
Power Supply Current
Wtoff
Wton
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Package Dimensions
HDIP26-P-1332-2.00
Unit: mm
Weight: 3.8 g (typ.)
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RESTRICTIONS ON PRODUCT USE
* Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
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